Apache webinar - Reliability Analysis for 28/20nm Electromigration (EM) and Electrostatic Discharge (ESD) (Jul 31)

Date: July 31, 2012
11:00AM - 12:00PM PDT
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Reliability checks for EM and ESD are becoming increasingly complex. As designs move to 28nm and beyond, power and signal line electromigration is an even more critical design sign-off requirement. In addition, ESD failures can significantly degrade the yield of a part unless simulation methods that address the HBM, CDM, and MM checks are utilized. Reliability is not only a long term affect but can also change the operation of a device through power noise and thermal impacts. In this presentation, an overview of the evolution of reliability challenges for advanced technology nodes will be provided, along with a methodology for addressing these issues using Apache's comprehensive reliability modeling and simulation solutions for power and signal EM, full-chip ESD and thermal-stress integrity.

Products Covered: RedHawk, Totem, PathFinder, Sentinel

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