Date: July 31, 2012
Time: 11:00AM - 12:00PM PDT
Reliability checks for EM and ESD are becoming increasingly complex. As designs move to 28nm and beyond, power and signal line electromigration is an even more critical design sign-off requirement. In addition, ESD failures can significantly degrade the yield of a part unless simulation methods that address the HBM, CDM, and MM checks are utilized. Reliability is not only a long term affect but can also change the operation of a device through power noise and thermal impacts. In this presentation, an overview of the evolution of reliability challenges for advanced technology nodes will be provided, along with a methodology for addressing these issues using Apache's comprehensive reliability modeling and simulation solutions for power and signal EM, full-chip ESD and thermal-stress integrity.
Products Covered: RedHawk, Totem, PathFinder, Sentinel