FARMINGTON, Conn., May 29, 2012 /PRNewswire-iReach/ -- Global Information, Inc. is pleased to announce two significant new reports on Integrated Circuit (IC) Packaging
The Worldwide IC Packaging Market, 2012 Edition
After a year of remarkable growth in 2010, when Integrated Circuit (IC) revenue grew 40.6% and units expanded 35.5%, 2011 experienced a slight downturn in the second half of the year. Semiconductor industry growth has nearly ground to a halt, expected to expand by just 4% in 2012, but the market take an upward path thereafter, according to New Venture Research's Worldwide IC Packaging Market, 2012 Edition market analysis.
The IC market is being driven by demand for handheld consumer devices and the adjoining infrastructure. The automobile industry has recovered, which are laden with semiconductor devices, yet supply has been dampened with the tsunami flooding of Japan and Thailand.
This report analyzes the semiconductor industry and forecasts the future of the global IC packaging market. It presents forecasts for each semiconductor product type, and segments these products by package family and I/O count range. Packaging revenue figures are displayed for each segment, based on prices charged in the contract assembly market. The package families are then rolled up by I/O count and semiconductor product. The report also profiles the activities of the world's largest contractors and the packages they offer.
An Executive Summary for this report and a free sample of the full document are available at http://www.giiresearch.com/report/nvr242228-worldwide-ic-packaging-market-2012-edition.html
Despite a relatively grim near-term outlook for IC packaging, the MEMS packaging, assembly, test and calibration market will grow three times faster than the overall IC packaging industry according to a new MEMS Packaging market research report from Yole Developpement.
This report forecasts the MEMS Packaging industry to reach $2.3B value by 2016. In package unit shipments, the MEMS packaging market is growing 2x faster (~ 20% CAGR) than what is predicted for the overall IC package market.
The report provides technical insight about key MEMS packaging technology trends & challenges, from MEMS-ASIC integration trends (SiP module versus SOC) to interconnect trends (wire-bond versus flip-chip versus WLP / TSV) to substrate approach (ceramic, leadframe, organic laminate, silicon/glass interposers). The report also offers a deep understanding of the MEMS packaging value chain, infrastructure & players, as well as package and substrate unit shipments and revenues by application
A summary for this report and a free sample of the full document are available at http://www.giiresearch.com/report/yd235731-mems-packaging.html
About Global Information, Inc. Global Information (GII) ( http://www.giiresearch.com) is an information service company partnering with over 300 research companies around the world. Global Information has been in the business of distributing technical and market research for more than 25 years. Expanded from its original headquarters in Japan, Global Information now has offices in Korea, Taiwan, Singapore, Europe and the United States.
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