EDI CON 2013 - Electronic Design Innovations Conference for RF, Microwave, Wireless and High Speed Digital Design and System Integration in China

A new technical conference and exhibition will focus on design concepts and techniques of RF, microwave and high-speed digital components and systems in China

NORWOOD, Mass., May 22, 2012 — (PRNewswire) — �Horizon House, a leading event organizer and publisher of technical trade periodicals for the RF, microwave and telecommunications industries, has announced plans to launch the inaugural Electronic Design Innovation Conference (EDI CON 2013) in Beijing, China in March 2013. EDI CON will be an annual event dedicated to providing design engineers and system integrators with the opportunity to learn about the latest RF, microwave and high speed digital products and technologies for today's communications, computing, RFID, industrial wireless monitoring, navigation, aerospace and related markets.

The conference program is being developed in partnership with industry and local academia and will feature the latest design techniques and technologies, workshops for advanced professional education and product training, business panel discussions of market trends, an exhibition of leading microwave companies, keynote talks from industry executives and government officials as well as a networking reception. 

With its focus on applications, emerging technologies and practical engineering solutions, EDI CON will bring together designers at the forefront of innovation in China and the world's leading multi-national technology companies. The event has already received wide and significant backing from the industry with Agilent Technologies, a leader in electronics measurement, committed as the Platinum Sponsor, pledging to support the conference and exhibition and play an active role in its development. Other major industry sponsors representing RF, microwave and high speed technologies in the areas of EDA software, semiconductors, passive components, systems and test/measurement solutions will be announced in the near future.

Agilent Technologies views EDI CON as a complementary driver to its technology and focus on nurturing and encouraging design innovation and development in China.

"We are proud to be an EDI CON, Platinum Sponsor. Agilent is well equipped to deliver solutions that address high-speed, high-frequency needs in microwave and RF test, both at the design and physical layers of test," said Guy Sene, senior vice president of Agilent Technologies Inc., and president of Agilent's Electronic Measurement Group. "Our engagement in current and rapidly emerging technologies delivers practical hands-on engineering test solutions for those at the exhibition and conference. EDI CON is designed to help attendees achieve the knowledge and skill development needed to meet the accelerating technology and market demands of today."

Horizon House is an experienced and well-established organizer of targeted events, including several major microwave related conferences/exhibitions such as the RF/Microwave, M2M and Microwave Backhaul Zones at CTIA and the European Microwave Week (EuMW) on behalf of the European Microwave Association (EuMA), orchestrating both events' long-term development and growth.

Ivar Bazzy, President, Horizon House Publications, said, "Horizon House has a proven track record in successfully organizing technical events. EDI CON is particularly exciting as it offers the opportunity to design a program that has been formulated through close collaboration with the industry itself to reflect and address the technological and educational needs of design engineers, while offering the business and industry context that is so vital in today's climate. With the help and input from our partners and the engineering/academic community in China, we aim to make EDI CON an event that will stimulate minds and encourage enterprise and growth, not only in 2013 but for many years to come."

Microwave Journal China, a Horizon House Publication and sister magazine of Microwave Journal, will actively promote and publicize EDI CON 2013 to local engineers, technology companies and academia, while also providing input from, and a link to, the wider high speed, high frequency, RF and microwave community.

For information on the conference program, ongoing updates and major announcements and to register for EDI CON 2013 visit: www.EDICONCHINA.com.

SOURCE Horizon House Publications

Horizon House Publications
Electronic Design Innovation Conference
EDI CON 2013
North America: David Vye
Phone: +1-781-619-1951
Email Contact Twitter: @MWJournal; International: Richard Mumford
Phone: +44-207-596-8787
Email Contact China: Katie Huang, 82420876, 58607751
Email Contact
Web: http://www.EDICONCHINA.com

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