IPC Conference on Flexible Circuits (June 12-14)
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IPC Conference on Flexible Circuits
IPC Conference on Flexible Circuits
June 12–14, 2012 | Irvine, California

Lars Wallin interview Nick Koop Nick Koop, Product Manager, Minco Products, Inc. discusses the importance of attending the IPC Conference on Flexible Circuits.
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AGENDA REGISTER HOTEL

Tuesday, June 12

WORKSHOPS

Rigid/Flex in the Making — Basic Level
Dale Smith, Consultant, DAS Flex Circuit, LLC
9:00 am–12:00 pm

Process Consideration for Flexible Circuits — from Metallization through Final Finishes — Advanced Level
Michael Carano, Director Marketing & Business Development, OMG Electronic Chemicals
2:00 pm-5:00 pm

NETWORKING RECEPTION FOR ALL PARTICIPANTS

5:00 pm–6:30 pm

Conference Agenda
Wednesday, June 13
8:00 am Check-in and Continental Breakfast
8:30 am Welcome and Introductions
Michael Carano, Director Marketing & Business Development, OMG Electronic Chemicals
8:45 am Keynote Presentation: The Future of Flexible Circuits Technology
Happy Holden, Director of Electronics, Gentex Corporation
9:45 am
Case Study: Organizational Transition — from Rigid to Flex
Yash Sutariya, V.P. — Corporate Strategy, Saturn Electronics Corporation/Saturn Flex Systems, Inc.
10:30 am BREAK
10:45 am Sales-Marketing Flex vs. Sales-Marketing of PCBs
Al Wasserzug, Director of Corporate Development, Vulcan
11:30 am Design, Fabrication and Electrical Analysis of High Speed Flex
Glenn Oliver, Design/Applications Engineer and Sidney Cox, Ph.D., Research Scientist, DuPont
12:15 pm LUNCHEON
1:15 pm Common Technical Challenges — Ask the Flexperts
Mark Verbrugge, Program Manager, Pica Manufacturing Solutions
Mark Finstad, CID, Senior Applications Engineer, Flexible Circuit Technologies, Inc. and Vice Chair of IPC Flex Circuits Design Subcommittee

2:15 pm

Aspect Ratio Does Not Matter Anymore
Nick Koop, Product Manager, Minco Products, Inc.
3:00 pm BREAK
3:15 pm Reduction of Voiding in Flexible Circuits Containing Microvias
Mitch Holtzer, Director, Global R&D Assembly Technology
Bawa Singh, Ph.D., Vice President & CTO, Cookson Electronics
Rahul Raut, Global R&D Project Manager, Cookson Electronics

4:00 pm

A New Approach to the Manufacture of Rigid Flex Circuits
Joe Fjelstad, Principal, Verdant Electronics
5:00 pm ADJOURN
Thursday, June 14
8:00 am Continental Breakfast
8:30 am New Guidance for Flexible Printed Boards: the Updated Design Standard IPC-2223
Mark Finstad, CID, Senior Applications Engineer, Flexible Circuit Technologies, Inc. and Vice Chair of IPC Flex Circuits Design Subcommittee
9:15 am Printed Electronics: an Overview — Basics, Limitations, and What is Achievable
Dan Gamota, President, Printovate Technologies, Inc.
10:00 am BREAK
10:15 am Advances in Flexible Printed Lighting Technology for High-Growth Markets
Marc Chason, President, Marc Chason & Associates, Inc.
11:00 am Economic and Market Trends for the Flexible Circuits Sector
Sharon Starr, Director of Market Research, IPC
ADJOURN
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HOTEL

Irvine Marriott
18000 Von Karman Avenue
Irvine, CA 92612-1004

To make your reservations and receive the discounted rate of $179, contact the Irvine Marriott directly at 800-228-9290 or +1 949-553-0100. Rooms are available until all rooms are booked or until May 21, 2012.
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HOSPITALITY SPONSOR:
POLAR    


TABLETOP SPONSORS:
eltek FTG allflex POLAR MicroCraft


MEDIA SPONSORS:
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PCB  magazine Global  SMT  &  Packaging EDA  café
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