Shanghai Huali Adoptes BSIMProPlusTM SPICE Modeling Platform for Huali’s Advanced Process Technologies

San Jose, California, Jan. 31, 2012 - ProPlus Design Solutions, Inc., the leader in SPICE Modeling products and technologies, today announced that Shanghai Huali Microelectronics Corporation (HLMC) has adopted its BSIMProPlusTM SPICE modeling platform and solutions to establish a complete flow, including data measurement, model parameter extraction/optimization/validation, and model retargeting for HLMC’s advanced technologies, 65/55nm, 45/40nm, and beyond.

Shanghai Huali Microelectronics Corporation is a dedicated semiconductor foundry jointly invested by Shanghai Alliance Investment Co., Ltd., Shanghai Grace Semiconductor Manufacturing Corporation, Shanghai Hua Hong NEC Electronics Co., Ltd., and Shanghai Hua Hong (Group) Co., Ltd. HLMC has been targeting at advanced technologies, including both 65/55nm and 45/40nm, and will offer logic and flash foundry services to fabless companies, IDMs, and other system companies.

Adopting the ProPlus modeling solutions enables HLMC to quickly establish in-house SPICE modeling and validation capabilities and provide high quality SPICE models to HLMC customers for its advanced process technologies. As a technology and market leader, ProPlus provides the most complete SPICE modeling solution with over 18 years of expertise in serving worldwide leading foundries, IDMs and fabless design companies. The BSIMProPlusTM SPICE modeling solution was chosen by HLMC for its high-efficient and powerful modeling environment, user-friendly interface and unique modeling solutions for advanced technologies.

“It is critical for HLMC to establish a complete, reliable, unified and efficient SPICE modeling extraction and validation flow to introduce advanced process technologies to its customers,” said Mr. Chris Shao, Senior Director of Technology Development Division I at HLMC. “As a 300mm wafer foundry targeting at advanced technologies beyond 65/55 nm, HLMC must provide customers with high-quality SPICE circuit simulation models. ProPlus has high reputation in products, technologies and customer support, and has made firm commitments to HLMC. We believe the collaboration with ProPlus is crucial for us to quickly set up and improve modeling capabilities for advanced technologies, and greatly enhance our market competitiveness.”

“We’re very happy to welcome HLMC adopting our modeling solutions," said Dr. Zhihong Liu, the Executive Chairman of ProPlus. "BSIMProPlusTM has been the primary choice for SPICE modeling by most leading semiconductor companies and fabless design houses for more than 10 years. ProPlus has paid special attention to the cooperation with HLMC, one of the key projects in China aiming at advanced process technologies, and HLMC will benefit from ProPlus’ knowledge and experiences in SPICE modeling, especially the unique technology advantages of advanced statistical models, reliability models and layout proximity effects, etc. ProPlus is committed to providing the best support for the technology development and customer services of HLMC’s advanced process, and working closely with HLMC, contributing to the whole industry. ProPlus devotes itself to enhance customer competitiveness, and we look forward to sharing the joy with their success.”

About ProPlus

ProPlus Design Solutions, Inc. delivers Electronic Design Automation (EDA) solutions with the mission to enhance the linkage between design and manufacture. The company provides cutting-edge solutions for Design for Yield (DFY) that consists of a device modeling technology platform BSIMProPlus™, targeted at nanometer device fabrication, and circuit design and electrical verification platforms, NanoDesigner™ and NanoVerifier™, targeted to meet the challenges of performance and yield trade-off for advanced analog and digital circuit designs. The company has R&D centers in the Silicon Valley, Beijing and Jinan, and branch offices in Tokyo, Hsinchu, and Shanghai. 

For more information, visit http://www.proplussolution.com.




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