Free Webinar on ESD Protection in Complex Analog/Mixed-Signal and High-Voltage Designs, Mar. 6

ERFURT, Germany — (BUSINESS WIRE) — March 1, 2012X-FAB Silicon Foundries, the leading foundry group in analog/mixed-signal semiconductor applications known for its expertise in “More than Moore” technologies, will present a free hour-long webinar next week, “On-Chip ESD Protection in Complex Analog/Mixed-Signal and High-Voltage Designs.” It explains how to eliminate the serious threat of electrostatic discharge (ESD) that can cause irreversible damage to integrated circuits (ICs). Please join X-FAB for this webinar to learn about various ESD protection concepts, and the structures and schemes available in X-FAB’s enhanced 0.35 and 0.18 micrometer high-voltage foundry processes to protect against electrostatic discharge. The webinar examines behavior, layout and application requirements. It also highlights similarities and differences among ESD protection concepts, outlining the advantages and disadvantages of each in circuit designs.

WHO:

   

Anyone wanting to learn about ESD protection methods and anyone

involved in analog/mixed-signal design with a focus on optimizing for ESD
robustness.
 

WHAT:

One-hour webinar that provides an overview of different ESD protection concepts.
 

WHEN:

Tuesday, March 6, 2012

Wednesday, March 7, 2012

9:30 – 10:30 a.m. PST 9 – 10 a.m. Central European Time (CET)
12:30 – 1:30 p.m. EST 4 – 5 p.m. China/Taiwan
5 – 6 p.m. Korea/Japan
 

WHERE:

Online webinar; registration links:

For North & South America: https://www2.gotomeeting.com/register/556664370

For Europe & Asia: https://www2.gotomeeting.com/register/827388330

 

WHY:

Efficient, convenient way to become better informed about different ESD protection concepts.
 

About X-FAB

X-FAB is the leading analog/mixed-signal foundry group manufacturing silicon wafers for analog-digital integrated circuits (mixed-signal ICs). X-FAB maintains wafer production facilities in Erfurt and Dresden (Germany), Lubbock, Texas (US) and Kuching, Sarawak (Malaysia), and employs approximately 2,400 people worldwide. Wafers are manufactured based on advanced modular CMOS and BiCMOS processes with technologies ranging from 1.0 to 0.18 micrometers, for applications primarily in the automotive, communications, consumer and industrial sectors. For more information, please visit www.xfab.com.

 

 



Contact:

X-FAB
Thomas Hartung, +49-361-427-6160
VP Marketing
Email Contact
or
ThinkBold Corporate Communications
Dagmar Berendes, +1-408-379-2344
Email Contact
Sarah Miller, +1-231-264-8636
Email Contact

 




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