Tech Soft 3D Announces Third Annual Customer Meeting at COFES 2012

BERKELEY, CA -- (MARKET WIRE) -- Feb 23, 2012 -- Tech Soft 3D, leading provider of component technology to the engineering software industry, today announced its third annual Customer Meeting will again be held at COFES, The Congress on the Future of Engineering Software, on Thursday, April 12, in Scottsdale, Arizona. The Customer Meeting will feature roadmaps, highlights and demonstrations of the HOOPS Product Suite, as well as a discussion of the industry variables that guide these time-tested and innovative components.

"We aggregate the needs of hundreds of application developers, so our strategic planning is a good bellwether of where things may be headed in the industry at large," said Tech Soft 3D CEO, Ron Fritz. "We look forward to again welcoming customers, partners, press and potential customers to what has become a fun and informative annual event."

Those interested in attending the invitation-only COFES can contact Ron Fritz at Email Contact to arrange an invitation. The event is slotted from 1-3 p.m. on Thursday, April 12 at the Scottsdale Plaza Resort, Las Palmas Room "A." For more itinerary details, visit the Annual Tech Soft 3D Customer Meeting webpage.

About COFES

COFES is a unique event that focuses on intense sessions of discussion, argument and debate on issues that will affect businesses that invest in and depend upon engineering technologies. The 13th annual COFES runs Thursday, April 12 through Sunday, April 15. See the COFES website for additional information on the agenda, keynote speakers and registration.

About Tech Soft 3D

Tech Soft 3D is the leading global provider of premier component technologies and related services that enable software developers to rapidly create world-class technical software. The company develops the HOOPS Product Suite, consisting of HOOPS Visualize, HOOPS Exchange and HOOPS Publish, SDKs for visualization, CAD data import/export and 3D PDF publishing. It also resells premium components such as Autodesk's RealDWG® Toolkit and AutoCAD® OEM platform and the Parasolid® Modeling Kernel from Siemens PLM Software. Tech Soft 3D software is used in nearly 450 applications worldwide. The company maintains corporate headquarters in Berkeley, California and can be reached through http://www.techsoft3d.com

 

 

 







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