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IBM, Samsung and GLOBALFOUNDRIES to Showcase Next-Generation Chip Technology at March Forum
Technology from industry's largest chip-making consortium powers majority of world's mobile devices and consumer electronics SANTA CLARA, Calif., Feb. 8, 2012 — (PRNewswire) — IBM (NYSE: IBM), Samsung Electronics, Co., Ltd., and GLOBALFOUNDRIES -- forming the world's largest chip-making consortium -- will preview the future of silicon technology at the 2012 Common Platform Technology Forum to be held at the Santa Clara Convention Center on March 14.Registration for the complimentary, one-day event at the Santa Clara Convention Center opens today. To register visit http://www.meetingconsultants.com/CommonPlatform/IBMBLAST "The Common Platform alliance is built upon an unmatched legacy of invention and deep commitment to research and development from IBM. The expertise of the companies is driving breakthrough technology innovations for semiconductor manufacturing. Our extensive and open ecosystem, focused on core manufacturing capabilities, gives our customers a flexible way to bring a wide range of semiconductor products to market," said Michael Cadigan, general manager of IBM's microelectronics division. The Common Platform Technology Forum will include keynotes from industry leaders and presentations from senior members of the Common Platform partners' management and technical teams. The forum will focus on collaboration for technology delivery, highlighting the rich and broad ecosystem of design enablement and implementation partners through a Partner Pavilion featuring leading EDA, IP, library, mask, packaging and design services companies. About the Common Platform
Jason Gorss
Lisa Warren-Plungy
Michael Corrado
SOURCE IBM
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