MOUNTAIN VIEW, CA – January 27, 2012 – Nimbic, the leading provider of Maxwell-accurate, 3D Full-Wave Electromagnetic Integrity solutions, today announced that Jim Hogan, Nimbic Board of Director, will join the panel discussion titled “ Why Do We Need 3D Design Standards? ” to be held at DesignCon 2012 in Santa Clara, California.
This panel will explore whether the design community needs 3D IC standards to accelerate the adoption of 3D design, and if so, how the standards can be implemented, the priority of these required standards, what are the challenges in doing so and how to get started. It will also provide insights on how the many different industry groups are working together to prevent overlapping efforts or missing critical areas. In a typical 3D IC, functional tiers will likely be coming from different companies and at different process nodes, and also different foundries as well. Without effective standards, it is difficult to efficiently integrate different tiers into a common package using best-in-class tools from multiple vendors and test the result. It is not possible to ensure a single EDA vendor flow spanning across the design of tiers designed by different companies .
WHERE: DesignCon 2012, Santa Clara Convention Center, Santa Clara, California
WHEN: Tuesday, January 31, 2012, 3.45pm – 5.00pm
- Riko Radojcic (Qualcomm)
- Sumit DasGupta (Si2)
- Liam Madden (Xilinx)
- Raj Jammy (SEMATECH)
- Bryon Moyer (Techfocus Media)
- Jim Hogan (Nimbic BoD)
For Jim Hogan’s presentation, visit http://www.nimbic.com/jimhogan
For additional information on the panel, visit http://designcon.com/technical_panels