Simulation Driven IC and Electronic Systems Design at DesignCon
At the upcoming DesignCon conference and exhibits being held at the Santa Clara Convention Center on January 30 – February 2, Apache Design will be showcasing our advanced low-power solutions for chip-level power analysis, optimization, and sign-off, as well as comprehensive methodologies for Chip-Package-System convergence. As the newest member of the ANSYS family, both Apache and ANSYS will be demonstrating how the multi-physics engineering software portfolio of the combined companies enables innovative simulation-driven IC and electronic system development for power-efficient, high-performance and noise-immune electronic products. Visit both Apache (#214) and ANSYS (#509) exhibit booths to find out how we are helping world’s top semiconductor companies reduce costs, mitigate risks, and accelerate product delivery.
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Register for a complimentary Expo Pass now.
Chip-Package-System (CPS) Workshops at DesignCon
Please join us for two educational CPS Workshops. Sponsored by Apache Design, a subsidiary of ANSYS, these interactive sessions will bring together leading semiconductor companies and system houses to share their expert perspectives and best practices on chip and package modeling, and system-level verification for SI, PI, EMI and thermal effects. For more information, click here.
Register for your complimentary Expo Pass and select one or both workshops during the registration process. There is no cost to attend the workshops, but registration is required.
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