Si2 Organizes 3D Panel at DesignCon 2012

"Why Do We Need 3D Design Standards?"

AUSTIN, Texas — (BUSINESS WIRE) — January 24, 2012 — The Silicon Integration Initiative (Si2) announced today the “Why Do We Need 3D Design Standards” panel session at DesignCon 2012. This panel will be held on Tuesday, January 31 in Ballroom E at the Santa Clara Convention Center, Santa Clara, CA, from 3:45 PM to 5:00 PM.

This panel will explore whether the design community needs 3D IC standards to accelerate the adoption of 3D design, and if so, how the standards can be implemented, the priority of these required standards, what are the challenges in doing so and how to get started. It will also provide insights on how the many different industry groups are working together to prevent overlapping efforts or missing critical areas. In a typical 3D IC, functional tiers will likely be coming from different companies and at different process nodes, and possibly different foundries as well. Without effective standards, it is difficult to efficiently integrate different tiers into a common package using best-in-class tools from multiple vendors and test the result. It is not possible to ensure a single EDA vendor flow spanning across the design of tiers designed by different companies.

The Panelists include:

Sumit DasGupta, Sr. VP, Si2

Riko Radojcic, Director, Qualcomm

Liam Madden, Corporate VP FPGA Development and Silicon Technology, Xilinx

Raj Jammy, Vice President of Materials and Emerging Technologies, SEMATECH

Jim Hogan, Investor, Telos Venture Partners

Bryon Moyer, Writer/editor, Techfocus Media

For more information on the Panel click here: http://schedule.designcon.com/session/6396

For a free DesignCon 2012 Expo Pass and Conference discount, click here: http://www.si2.org/?page=1516

About Si2

Si2 is the largest organization of industry-leading semiconductor, systems, EDA and manufacturing companies focused on the development and adoption of standards to improve the way integrated circuits are designed and manufactured, in order to speed time-to market, reduce costs, and meet the challenges of sub-micron design. Now in its 24th year, Si2 is uniquely positioned to enable timely collaboration through dedicated staff and a strong implementation focus driven by its member companies. Si2 represents over 90 companies involved in all parts of the silicon supply chain throughout the world. See www.si2.org

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Contact:

Silicon Integration Initiative
William Bayer, 512-342-2244, ext. 304