"Tensilica presented us with an intriguing application for their customizable dataplane processor technology and we worked with Tensilica to evolve that into a product that worked very well for our requirements. We needed a DSP that went well beyond what else we could find on the market in terms of optimum power/performance/area," stated Andrew Turley, director of innovation for Car Entertainment, NXP. "NXP and Tensilica worked together to get a truly optimized solution that has the necessary DSP performance to tackle multi-standard next-generation digital radio applications in a small and power-efficient core."
"We are honored that NXP, as the market leader for car entertainment semiconductors, has selected Tensilica as their DSP provider and was a lead partner for our ConnX BBE," stated Jack Guedj, Tensilica's president and CEO. "Our collaboration with NXP has helped us optimize our ConnX BBE and validates the benefits of Tensilica's customizable dataplane processors (DPUs) to build the most efficient digital signal processing engines for mobile wireless communications."
About NXP Semiconductors
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Forward-looking Statements / NXP Semiconductors
This document includes forward-looking statements which include statements regarding our business strategy, financial condition, results of operations, and market data, as well as any other statements which are not historical facts. By their nature, forward-looking statements are subject to numerous factors, risks and uncertainties that could cause actual outcomes and results to be materially different from those projected. These factors, risks and uncertainties include the following: market demand and semiconductor industry conditions, our ability to successfully introduce new technologies and products, the demand for the goods into which our products are incorporated, our ability to generate sufficient cash, raise sufficient capital or refinance our debt at or before maturity to meet both our debt service and research and development and capital investment requirements, our ability to accurately estimate demand and match our production capacity accordingly or obtain supplies from third-party producers, our access to production from third-party outsourcing partners, and any events that might affect their business or our relationship with them, our ability to secure adequate and timely supply of equipment and materials from suppliers, our ability to avoid operational problems and product defects and, if such issues were to arise, to rectify them quickly, our ability to form strategic partnerships and joint ventures and successfully cooperate with our alliance partners, our ability to win competitive bid selection processes to develop products for use in our customers' equipment and products, our ability to successfully establish a brand identity, our ability to successfully hire and retain key management and senior product architects; and, our ability to maintain good relationships with our suppliers. In addition, this document contains information concerning the semiconductor industry and our business segments generally, which is forward-looking in nature and is based on a variety of assumptions regarding the ways in which the semiconductor industry, our market segments and product areas will develop. We have based these assumptions on information currently available to us, if any one or more of these assumptions turn out to be incorrect, actual market results may differ from those predicted. While we do not know what impact any such differences may have on our business, if there are such differences, our future results of operations and financial condition, and the market price of the notes, could be materially adversely affected. Readers are cautioned not to place undue reliance on these forward-looking statements, which speak to results only as of the date the statements were made; and, except for any ongoing obligation to disclose material information as required by the United States federal securities laws, we do not have any intention or obligation to publicly update or revise any forward-looking statements after we distribute this document, whether to reflect any future events or circumstances or otherwise. For a discussion of potential risks and uncertainties, please refer to the risk factors listed in our SEC filings. Copies of our filings are available from our Investor Relations department or from the SEC website, www.sec.gov.
Tensilica, Inc. is the leader in dataplane processor IP cores. Dataplane processors (DPUs) combine the best capabilities of DSPs and CPUs while delivering 10 to 100x the performance because they can be optimized using Tensilica's automated design tools to meet specific and demanding signal processing performance targets. Tensilica's DPUs power SOC designs at system OEMs and seven out of the top 10 semiconductor companies for designs in mobile wireless, telecom and network infrastructure, computing and storage, and home and auto entertainment. For more information on Tensilica's patented, benchmark-proven DPUs visit www.tensilica.com.
- Tensilica and Xtensa are registered trademarks belonging to Tensilica, Inc. All other company and product names mentioned are trademarks and/or registered trademarks of their respective owners.
- Tensilica's announced licensees include: Afa Technologies, ALPS, Aquantia, Astute Networks, Atheros, AMD, Avision, Bay Microsystems, Brocade, Broadcom, Cavium, Chelsio, Cisco Systems, CMC Microsystems, Conexant Systems, Design Art Networks, EE Solutions, Epson, Fujitsu Ltd., Fujitsu Microelectronics, Huawei, iBiquity Digital, Ikanos Communications, Intel, Juniper Networks, LG Electronics, Lucid Information Technology, Marvell, Maxim, NEC Corporation, Nethra Imaging, Novatek, NuFront, NXP Semiconductors, Olympus Optical Co. Ltd., Panasonic Mobile, Plato Networks, PnpNetwork Technologies, PowerLayer Microsystems, QLogic, Samsung, SiBEAM, Sirius XM Radio, Sony, Stretch, TranSwitch Corporation, Triductor Technology, Valens Semiconductor, Validity Sensors, Victor Company of Japan (JVC), and Wolfson Microelectronics.
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