Infotech Signs a New Multi-Year Engineering Services Agreement with a Tier 1 Telco

Paragould, AR, November 2011 - Infotech Enterprises America, Inc. has entered into a new multi-year engineering services agreement with a Tier 1 Telecommunications service provider in North America. The agreement includes OSP planning, survey, engineering, and drafting for multiple disciplines including BAU, FTTP, MDU, DS1, and high bandwidth circuit engineering (DS3 and above) covering each regional service area for the client. Infotech began the work on November 1, 2011 and it will continue over the next three years.

For more information on this service agreement, please contact Chuck Roming at Email Contact.

Infotech Enterprises, with over 20 years of experience, provides leading-edge engineering solutions including product development and life-cycle support, process, network, and content engineering to major organizations worldwide. Our clients span multiple industries such as Aerospace, Consumer, Energy, Medical, Heavy Equipment, HiTech, Transportation, Telecom, and Utilities and include 22 'Fortune 500' and 27 'Global 500' blue chip organizations. Infotech's US headquarters is located at 330 Roberts Street, East Hartford, CT. For more information, please visit

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