Nimbic VP of R&D, Dr. Dipanjan Gope, to Present Seminar on 3D Full-Wave Package-Board Simulation Aided by the Cloud, Nov. 17

AUSTIN, TX – November 8, 2011 – Nimbic, a leading provider of SaaS-based, cloud-computing 3D Fullwave Electromagnetic Integrity solutions for Signal Integrity (SI), Power Integrity (PI) and Electromagnetic Interference (EMI), today announced that Dr. Dipanjan Gope, Vice President, R&D of Nimbic, will present in IEEE CPMT Austin Chapter seminar titled “3D Full-wave, Package-Board Simulation Aided by the Cloud” to be held at Freescale in Austin, Texas.

The drive towards high-performance, high-functionality, low-cost packages has given rise to an increased requirement for using 3D full-wave electromagnetic solvers for design and verification. However, analysis of large scale package-board systems present significant challenges in terms of memory capacity to fit the solver matrix, and time-bottlenecks preventing quick turnaround required for early design optimization. Fast solver algorithms developed over the last 2 decades have alleviated the problems to an extent. The emergence of cloud computing and the corresponding on-demand availability of custom computing instances, presents a unique opportunity to meet the time-memory requirements and enter the “simulation-in-a-coffee-break” paradigm. In order to harness the true potential of the cloud infrastructure, a multilevel parallelization scheme is adopted:

  • The bottom-most parallelization layer consists of multi-threading with OpenMP to utilize the many cores of an individual machine instance and the available shared memory.
  • The second layer uses Message Passing Interface (MPI) to seamlessly combine the shared-memory on multiple instances to fit a larger matrix size.
  • The third layer uses SGE to distribute the multiple port solutions in the solve stage.
  • The top-most layer is an umbrella of SGE that parallelizes for discrete frequency or parametric sweeps, a type of parallelization which fall under the so-called “pleasingly parallel” form.

WHAT:            3D Full-wave, Package-Board Simulation Aided by the Cloud

WHERE:          Freescale, Building B, 7700 Parmer Ln, Austin, TX 78729

WHEN:            Thursday, November 17, 2011 6.00PM to 7.30PM

WHO:              Dr. Dipanjan Gope, Vice President of R&D, Nimbic

About Nimbic

Nimbic is the leading provider of SaaS-based, cloud-computing 3D Fullwave Electromagnetic Integrity solutions. Nimbic enables high-speed and high-capacity 3D electromagnetic signal integrity, power integrity and EMI analysis field solutions for the microelectronics industry. Nimbic’s global customers include Texas Instruments, Renesas, Toshiba, Qualcomm, Tabula and Panasonic.  Nimbic’s nCloud solution facilitates efficient and robust chip-package-system co-design while significantly reducing time-to-market and costs.  Nimbic’s accelerated technology delivers unprecedented capacity handling, significantly faster speed than current methodologies, and the ability to span the entire design cycle in 3DIC, package and system simulations, while maintaining uncompromising Maxwell accuracy.

For additional information, please visit  www.nimbic.com.

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Media Contact:

Bala Vishwanath, Chief Marketing Officer, Nimbic 800-686-5213 media@nimbic.com




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