DISCUS to Present at Boeing-Northrop Global Product Data Interoperability Summit

DISCUS to present on the iTDP and PPAP at the 2011 Conference on Product Data Exchange

COLUMBUS, Ohio — (BUSINESS WIRE) — November 3, 2011DISCUS Software Company, a global leader in software tools for manufacturing engineering and quality planning, announced today that the company will present at the 2011 Global Product Data Interoperability Summit (GPDIS), November 7-10 in Chandler, Arizona. This exclusive conference, hosted by the Boeing Company (NYSE: BA) and the Northrop Grumman Corporation (NYSE: NOC), has grown to be one of the premiere events for industry professionals focused on PLM and product data exchange.

GPDIS 2011 focuses on the global supply chain and the data interoperability challenges presented by the implementation of model-based processes. DISCUS will present the use of the intelligent Technical Data Package (iTDP) for enabling the Production Parts Approval Process (PPAP).

GPDIS offers attendees a unique opportunity to gain insight into current technological capabilities and best practices used throughout aerospace, automotive, shipbuilding and other industries. DISCUS will also participate in the product exhibition, which showcases the latest solutions offered by select technology providers. DISCUS will be demonstrating the use of DISCUS Desktop and the new web-based DISCUS Connect.

About DISCUS Software

The DISCUS product family is the leading tool set for reducing the time and labor for first article inspection, inspection planning, process planning, and producibility analysis. DISCUS software tools are used by more than 800 organizations, ranging from large companies such as Lockheed, Raytheon, and Rolls Royce to members of the supply chain such as Barnes Aerospace, Triumph, and Turner Medical. DISCUS may be found on the web at: http://www.DISCUSsoftware.com, or twitter.com/DISCUS_software



Contact:

Springboard Marketing
Jessica Swayze, 937-244-9192
Email Contact




Review Article Be the first to review this article
Downstream : Solutuions for Post processing PCB Designs

Aldec

Featured Video
Editorial
Peggy AycinenaWhat Would Joe Do?
by Peggy Aycinena
Real Intent: Leveraging on Investments
More Editorial  
Jobs
Senior R&D Engineer...Timing Closure Specialist for EDA Careers at San Jose or Anywhere, CA
Technical Support Engineer EU/Germany/UK for EDA Careers at N/A, United Kingdom
Field Application Engineer for Teradyne Inc at San Jose, CA
Senior Front-End RTL Design AE for EDA Careers at San Jose, CA
Analog Hardware Engineer for Teradyne Inc at San Jose, CA
FPGA Engineer for Teradyne Inc at San Jose, CA
Upcoming Events
CODES+ISSS 2017, Oct 15-20, 2017, Lotte Hotel, Seoul, South Korea at Lotte Hotel Seoul Korea (North) - Oct 15 - 20, 2017
DVCon 2017 Europe, Oct 16 - 17, 2017, Munich, Germany at Holiday Inn Munich City Centre Munich Germany - Oct 16 - 17, 2017
11th International Symposium on Networks-on-Chip (NOCS 2017) at Seoul Korea (South) - Oct 19 - 20, 2017
Verific: SystemVerilog & VHDL Parsers
TrueCircuits: IoTPLL



Internet Business Systems © 2017 Internet Business Systems, Inc.
25 North 14th Steet, Suite 710, San Jose, CA 95112
+1 (408) 882-6554 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering TechJobsCafe - Technical Jobs and Resumes GISCafe - Geographical Information Services  MCADCafe - Mechanical Design and Engineering ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise