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Title : STABLCOR® Presentation
Company : ThermalWorks
Date : 12-Jul-2005
Downloads : 66

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STABLCOR is a new development in the printed circuit board (PCB) industry, providing excellent thermal conductivity, low coefficient of thermal expansion (CTE) and high stiffness compared to conventional FR4 PCBs. Originally developed under a NASA contract, the STABLCOR technology is now controlled by Thermalworks. The purpose of this test was to determine the advantages of the STABLCOR boards in comparison to standard PCBs for memory module applications. Samsung is currently evaluating STABLCOR board technology for use in their high-density memory modules, and sent Thermalworks modules to test concurrently at CMTL (computer memory test labs). All modules used in this test were assembled in Korea at the Samsung plant. The modules in test are the 1 Gigabyte stacked memory PC-133 SDRAM. The testing was completed at CMTL in Huntington Beach, CA.
User Reviews More Reviews Review This File
we will see - Wolfgang - Report As Inappropriate
General interest - Lawlor - Report As Inappropriate
Would like more information as a number of our key customers are asking for guidance on material supplies - Jeff Allen - Report As Inappropriate


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