Micro-electromechanical systems (MEMS) represent a highly cost-effective way of building tiny sensors and actuators. But a major problem with MEMS devices is that they need to be hermetically sealed: a level of protection much higher than that generally used for integrated-circuit packaging. As they can measure as little as 1mm on a side, handling MEMS devices is extremely difficult and the use of conventional packaging techniques can damage the delicate MEMS structures. The alternative is to perform packaging at the wafer level.
|
Editorial
Upcoming Events
DAC 2012 at San Francisco CA - Jun 3 - 7, 2012
|
|
|
