For a long time ATE companies deliver
high quality ICT, Functional and Flying
probe Testers. Today’s Electronic
trends towards higher density and
speed has pushed electronic board
testers into an accessibility bottleneck
which affects peculiarly the Bed of Nails
(BoN).
It led ATE companies to allow add-on
JTAG testers, using Boundary Scan
technique, to restore the declining test
coverage. A seamless integration of
both technologies is mandatory to
make full use of Boundary Scan
promise.
While Marketers and analysts predict a
symbiotic future, SEICA and TEMENTO
SYSTEMS demonstrate an efficient
integration TODAY.
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Editorial
Upcoming Events
DAC 2012 at San Francisco CA - Jun 3 - 7, 2012
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