Featured by: Alexei L. Glebov, Michael G. Lee, Kishio Yokouchi
Abstract. Integration technologies for board-to-board optical interconnect
systems are presented. In the module architecture, optical transmitters
and receivers are placed on the line cards and the signals are routed
to the optically passive backplane through optical jumpers. The backplane
contains a light guiding layer with embedded polymer waveguides
WGs and 45-deg reflector micromirrors. The WGs are fabricated by
direct lithographic patterning and have propagation losses as low as
0.05 dB/cm. The wedge dicing technology is developed for fabrication of
the 45-deg micromirrors with 0.5-dB excess losses
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Editorial
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DAC 2012 at San Francisco CA - Jun 3 - 7, 2012
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