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Title : Reduce Power, Area and Routing Congestion - Analysis of a High-Performance On-Chip-Bus Interconnect
Company : Synopsys Inc.
Date : 03-Feb-2010
Downloads : 44

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This paper, using an example design, demonstrates how to meet challenging performance, latency and bandwidth goals by using the DesignWare® Interconnect Fabric for the ARM® AMBA® 3 AXI™ while minimizing the total area, power consumption and number of top-level wires. The paper also studies the design requirements and examines the optimization features of the DesignWare Interconnect Fabric used to meet the stringent timing requirements. Detailed technical analysis is provided for the selected architecture, pipelining mode, arbitration scheme and the slave visibility feature employed to reach timing closure for the links with demanding performance requirements. Final results are presented based on the hybrid architecture of the DesignWare Interconnect Fabric used to optimize the infrastructure resulting in a reduction in area, power and routing congestion.
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