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Title : Predicting Chip-Package Resonance of the Power Distribution Network Using PrimeRail
Company : Synopsys Inc.
File Name : golovanov_paper.pdf
Size : 263032
Type : application/pdf
Date : 29-Sep-2006
Downloads : 49

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Featured Paper by Greg Beers, Jamie Kirk, Scott Coates, Cristian Golovanov, Andrew Cirigliano

In advanced technologies at 130nm and finer geometries, the on-chip power integrity has become a major source of concern. One of the challenges is to identify the resonance frequency of the RLC circuit formed by the package inductance and the on-chip capacitance. Operating the chip close to the resonance frequency will result in out-of specification supply voltages and excessive clock jitter.
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