Solder Paste Inspection Technologies: 2D-3D Correlation - EDACafe Downloads

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It is understood that the solder paste printing process presents far more opportunities for defects than any of the other individual Surface Mount Technology (SMT) Manufacturing Processes. In addition, transition to lead free solder paste and use of miniature components, has increased the complexity of the printing process. It has been proven that the lead free solder pastes do not spread or “wet” as well as tin lead solder pastes.

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