In 2006 we conducted two formal detailed experiments on the 01005-component assembly process. Two of the most significant findings from those experiments were that a 0.003” thick stencil is required to achieve an acceptable solder paste release percentage and that nitrogen is required for complete reflow of the very small volume of solder paste. For the most part, several other researchers had concluded the same for 01005 component assembly experiments.
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Editorial
Upcoming Events
DAC 2012 at San Francisco CA - Jun 3 - 7, 2012
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