Defluxing of Eutectic and Lead-Free Assemblies in a Single Cleaning Process - Oct. 2006 - EDACafe Downloads

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As the entire electronic manufacturing industry braced for the July 1, 2006 deadline, it has been reevaluating the entire production process. Likewise, the precision cleaning industry must also prepare for the impending deadline as lead-free solder paste formulations will increase cleaning demands.

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