Over the last several years there has been a great deal of advancement in post-print inspection technology. The capability to inspect printed solder paste deposits immediately after the printing process and immediately before the component placement process has become more accurate, more repeatable and much faster. Post print solder paste inspection systems which are an integral feature of the printing machine itself or a standalone automated optical inspection (AOI) system are now able to provide much more reliable inspection capability at or near the speed of the product cycle times.
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Editorial
Upcoming Events
DAC 2012 at San Francisco CA - Jun 3 - 7, 2012
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