One manufacturing process used to attach RFI shields for medical applications/cellular phone circuit board assemblies
consists of “snapping” the shell-like shields onto solder spheres that are soldered to printed circuit board [PCB] pads [1]. The
snapped on RFI shields do not require soldering onto the printed circuit board and can be removed if necessary. In order to
create a large enough solder balls for the shell to snap onto, a large quantity of material must be available
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Editorial
Upcoming Events
DAC 2012 at San Francisco CA - Jun 3 - 7, 2012
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