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For Electronic Design Automation (EDA) applications and designers, 3D physical analysis has moved into the mainstream, reducing the need to re-design and delivering more predictable product performance and reliability. Two main factors driving the need for precise 3D geometric modeling and analysis within the EDA industry are high frequency switching and characterization of manufacturing variations. Understanding the physical characteristics of wireless clients, advanced packaging, die stacking, and scaled manufacturing processes is critical to the delivery of high-quality products.
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