Current traditional approaches to PCB design and manufacture meet up with numerous signal integrity problems at high data rates. Manufacturing artifacts such as inconsistencies in dielectric properties, inconsistencies in trace width, variation in circuit spacing, uneven copper thickness and/or adhesion treatments can impact signal performance. In addition, the standard electrical concerns of resistance, dielectric loss, conductor loss, stray capacitance elements, signal skew and inductance/cross talk and potential reflections due to electronic stubs from circuit features such as vias, also appear at high data rates. The net of this complex problem set is that they make it extremely difficult to predict and design for maximum performance.
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Editorial
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DAC 2012 at San Francisco CA - Jun 3 - 7, 2012
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