Featured Paper by Teh Chih Chiang
Shrinking process technology has reduced the effectiveness of the traditional Stuck-at fault
model as a tool to maintain high defect coverage. For high defect coverage, it is now mandatory
to include Bridging-fault and Transition-fault models. In the complex SOCs that engineers are
designing today, they are using substantially more flip-flops in a design than they’ve ever used.
All these flip-flops translate to longer scan chains and more test data. The solution to control test
cost and still maintain high detection of defect coverage is “compression.”
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Editorial
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DAC 2012 at San Francisco CA - Jun 3 - 7, 2012
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