This paper suggests the need for a new co-simulation analysis flow to enable design adjustments among chip, package and board to positively impact power integrity and cost. A chip centric analysis showed that co-simulation identified issues that could not be observed with analysis of the IC power delivery system alone. Various on-chip decoupling strategies were assessed along with multiple package and board decap schemes. Sigrity's Broadband Network Paramer (BNP) format is mentioned as key enabling technology.
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Editorial
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