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Title : Packaging a Supercomputer in PCI Express Form Factor
Company : SIGRITY, Inc.
Date : 06-Apr-2008
Downloads : 3

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This paper looks at the trade-offs between power, cooling and performance involved in packaging the Cell Broadband Engine, multi-core graphics processor, and associated bridge chip on a PCI ExpressTM card together with large amounts of memory. In particular, it examines AC and DC power distribution over twenty domains, PCI Express compliance, and timing specification for a DDR2 interface.
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