As clock speeds increase into the gigaHertz regime and rise times decrease into the picosecond regime, the interaction between capacitors and power/ground planes of a package on which they are mounted becomes vitally important to the performance of a power delivery system. To include the interaction between the capacitor and the package, a 3D distributed model is proposed to more accurately evaluate the total loop inductance of a capacitor mounted on pads over vias connected to power/ground planes. The comparison of loop inductance modeling methods based on one-plane and twoplane models using various modeling tools is given. The modeled data match well with the measured data. After validating the distributed capacitor models, performance evaluation of the complete power delivery system based on a lumped and a distributed model of capacitors is made.
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Editorial
Upcoming Events
DAC 2012 at San Francisco CA - Jun 3 - 7, 2012
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