3D semiconductor packages enable the form and function
for many of the devices we use in our daily lives - mobile
handsets, personal entertainment devices, and flash drives to
name a few. For some, these 3D packages play a critical role
in improving quality of life as they rely on implantable
medical devices like insulin pumps or defibrillators.
Functional density, weight, and configurability are just a few
of the reasons why a growing number of semiconductor
products are going vertical using stacked-die, Package-on-
Package (PoP),
|
Editorial
Upcoming Events
DAC 2012 at San Francisco CA - Jun 3 - 7, 2012
|
|
|
