In this paper an application of an integral analysis technique is demonstrated for determining Signal Integrity (SI) and
Power Integrity (PI) of complex and advanced package solutions. A representative System-in-Package (SiP) product has been
selected as a carrier for our study, which is focused on analysis methodology, tools and flow. In particular, possibility to easily
support what-if simulations for SI and PI, including analysis with distributed on-chip decoupling capacitors is investigated and
highlighted. Importance of balancing between accuracy, CPU time and ease-of- use is also underlined.
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Editorial
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