Title : Die Level Process Monitors and Test Structures Company : Ridgetop Group, Inc. File Name : Ridgetop Die Level Test Structures.pdf Size : 3146453 Type : application/pdf Date : 04-May-2010 Downloads : 44

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In the silicon debug process, the basic question needs to be answered; do I have a process problem or a design problem? Unlike conventional ring oscillator based, scribe line based structures, Ridgetop's patented approach provides fabless semiconductor firms with effective tools to help accelerate silicon debug. Ridgetop's proven die level test structures allow more precise monitoring and troubleshooting for advanced IC design. Self-contained and occupying minimal space, the structures can be used to measure critical mismatch parameters and the extent of NBTI effects (intermittencies).

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