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Co-design in the chip-package-board ecosystem is gathering speed. There are several instances where chip design and package design, in the presence of early PCB models, need to be performed nearly simultaneously. In particular, electrical co-design with emphasis on signal and power integrity (SI and PI), switching noise integrity (SNI), and electromagnetic interference (EMI) mitigation is becoming critical for first-pass design success. This is particularly critical in today’s technical and business environment where there is a growing need for reduced-times-to-market in competitive environments while design teams are becoming smaller and more streamlined.
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