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PakSi-TM’s Direct CAD Interface (DCI) Capabilities is an expert system to predict solder joint fatigue life of IC packages. PakSi-SJF is a full featured package modeling tool, with user- friendly GUI that helps users easily set up complex thermal cycling information and creep strain rate properties, to predict solder joint life automatically. PakSi-SJF makes solder joint reliability analysis easy for all the designers.
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