Ball Grid Array packages provide a new challenge for the surface mount industry. In all peripheral leaded packages (e.g. Quad Flat Packs or QFPs), the final solder joints can be visually inspected to guarantee quality of both the process and the resulting joint. In contrast, BGA packages, when attached to a printed circuit board (PCB), effectively hide the solder joints between the package body and the board. Only the outside row might be visibly inspected, and that will depend on proximity and location of neighboring components. Thus the guarantee of quality of the surface mount process for BGAs can not be accomplished through visual inspection. Instead it is simple process control, combined with package design, that drive significantly higher soldering yields than are achieved with fine pitch QFP devices. This document is intended to provide some guidance in the control methods and limits required to successfully implement BGA packages into the surface mount assembly process.
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Editorial
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DAC 2012 at San Francisco CA - Jun 3 - 7, 2012
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