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Has Your Known Good Die Died? A Methodology For Reliable SiP Applications Naresh Baliga Vice President, Marketing Inapac Technology Inc. The relentless drive for rich media applications in portable consumer products (camera phones, media players, digital cameras, mobile gaming devices, etc.) is fueling the need for progressively higher memory speeds and capacities. Meanwhile, tight system-level constraints over power, form factor and performance are forcing silicon providers to consider approaches to blend multiple functions into a single chip as either a system-on-chip (SoC), where the necessary components are integrated onto a single silicon die, or a system-in-package (SiP), where different die are assembled together in a single package.
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