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Featured Paper by Christian Schuster, Young Kwark, Giuseppe Selli and Prathap Muthana Vias in printed circuit boards (PCBs) and packages are among the components of most concern with respect to signal and power integrity in high-speed communication systems. A good amount of research has been conducted to analyze their behavior. However, when it comes to “physical” or “physics-based” understanding and modeling, vias prove to be quite elusive due to their complex environment. In our opinion the lack of physical via models leads to increased design times and over-engineering, both of which negatively impact system cost. In this paper we will review existing models and summarize our results based on measurements and simulations.
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