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Title : MPC603 and MPC604 Thermal Analysis
Company : Freescale Semiconductor Inc.
Date : 22-Feb-2007
Downloads : 3

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Computer system performance has dramatically improved over the past three decades. Much of this improvement is a result of the increased integration of components at the semiconductor level made possible by reduced feature sizes. The level of integration now possible at the chip level has resulted in several semiconductor integrated-circuit (IC) trends, all of which are increasing: gate count, chip inputs/outputs, chip size, operating frequency, and power consumption.
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