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Title : Downstream Thermal Implications of Component Placement
Company : Flomerics
File Name : Thermal Implications Component Placement.pdf
Size : 170382
Type : application/pdf
Date : 10-Aug-2004
Downloads : 23

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Moving the highest power components to the leading edge of the board is a good start to thermally optimizing a component layout but it is often not feasible or may adversely affect components downstream.
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