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Title : Resin Coated Copper Capacitive (RC3) Nanocomposites for Multilayer Embedded Capacitors
Company : Endicott Interconnect Technologies
Date : 02-Jan-2009
Downloads : 1

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Polymer nanocomposites have attracted much attention for building large-area, mechanically flexible electronic devices [1-5]. The small dimensions, strength and the remarkable physical and electrical properties of these structures make them a very unique material with a whole range of promising applications. Addition of different fillers into the polymer matrix controls the overall electrical properties of the nanocomposites. For example, addition of zinc oxide nano particles into polymer show laser like behavior upon optical pumping [1] and addition of layered silicate nanoparticles into gel electrolytes results in high conductance[3]. There is also a strong desire to develop new large-scale advanced materials that can meet the growing demand for miniaturization, high-speed performance, and flexibility for microelectronic products. An effort in this direction is presented in this paper.
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