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Title : An Experimental and Computational Study of the Current Carrying Capacity of High Performance PWB Interconnections
Company : Endicott Interconnect Technologies
Date : 02-Jan-2009
Downloads : 2

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As complex circuit board assemblies get denser and higher in signal frequency, they require more and more current. For a multi-module large digital board, it is not uncommon to have 10 or 20 modules, each of which needs 200A at some core voltage near 1.0 volts. Each module also has thousands of I/O copper on both sides. A layer of dielectric and copper is stuck to both sides of the etched plane-plane core. Holes are then drilled all the way through the structure. Lastly, the hole is filled with conductive paste and the outer copper is etched away, yielding a 0S1P joining core.
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