|
Smaller, lower cost components are crucial to the development of today’s higher-performance, smaller and increasingly price-competitive mobile devices. Since the introduction of chip scale packages (CSPs) they have become a major trend in active device packaging. Chip scale packaging combines the size and performance advantage of bare die assembly and the reliability of encapsulated devices, while permitting automated assembly processes and low production costs.
|
||||||
|
||||||
|
||||||
