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Many manufacturers choose jetting technology to meet the demands of automated adhesive application processes. As more manufacturers in a variety of industries become aware of its advantages, jetting will become increasingly popular as the dispense technology of choice for adhesives.Companies currently use jetting for corner-attach bond, chip-stack packages (CSP), flip chip, no-flow, and pre-applied underfill applications, as well as conductive, surface mount, UV-cure adhesives, and silver epoxy. Because jet technology represents a paradigm shift from needle dispensing, it is becoming more popular as the chosen dispense technology for adhesives.
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