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Title : Advancement in HPC Improves Engineering and Electronic Cooling Simulations
Company : Appro International
File Name : AdvancementInHPC_2007June26final.pdf
Size : 1351640
Type : application/pdf
Date : 06-Aug-2007
Downloads : 6

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This document discusses high performance computing (HPC), which is experiencing fast growth although it still presents many challenges, such as data center requirements. This document first presents details about recent HPC market growth and trends, as well as electronic design automation (EDA) growth and trends. Customer examples are included.

This document also discusses HPC with regard to simulation-based design for the electronics industry. Key sectors and business drivers are described, along with solutions for mechanical, electromagnetic, thermal and computational fluid dynamics (CFD) challenges.

There are scalable and reliable solutions for HPC. This document describes data center challenges and HPC solutions that are currently available, as well as some future solutions.

Productivity can be maximized with multicore technologies. This document describes a quad-core processor that delivers performance-per-watt leadership, advanced leadership in x86 virtualization and reduced cost of ownership.
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