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Design For Manufacturing (DFM) has been paid attention as the feature size on chip goes down below the k1 factor of 0.25. Lots of DFM related ideas have been come up, tried, and some of them adopted for wider process window and as a result, higher yield. As the minimum features are getting shrunk, the design rules become more complicated, but still not good enough to describe the complexity and limitation of certain patterns that imposes narrow process window, or even failure of device. Thus, it becomes essential to identify, correct, or remove the litho-unfriendly patterns (more widely called as hot spots), before OPC. One of the efforts is to write a DFM rules in addition to conventional DRC rules.
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