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The purpose of this document is to provide a centralized listing of package thermal characteristics (Junction-to- Ambient and Junction-to-Case). This listing is not specific to individual devices sold by Analog Devices; it is representative of typical values for a given package and pin count. When the data sheet for a specific product lists thermal characteristics, that data is correct for that specific device and reflects any thermal enhancements that have been made in the packaging of that device.
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