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This paper will summarize joint work between ST Microelectronics, Amkor Technology and Nokia; to qualify Amkor’s through mold via (TMV™) bottom package technology for next generation high density PoP applications. The 12 x 12mm daisy chain test vehicle reported in this joint work includes a thin flip chip die in a fully molded bottom package with 516 bottom BGAs at 0.4mm pitch and 168 top solderable through mold vias at 0.5mm pitch.
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